| PART |
Description |
Maker |
| M36P0R9060E0 M36P0R9060E0ZACE M36P0R9060E0ZACF |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package
|
STMicroelectronics
|
| W82MV-NSBC W82MV-NSBI |
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
http://
|
| 23-22C-S2BHC-B30-2A11 |
Reverse Package Chip LED (Multi-Color)
|
Everlight Electronics Co., Ltd
|
| M36L0R7050L1ZAMF M36L0R7050L1ZAME M36L0R7060U1ZAMF |
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位（复用的I / O，多银行，多层次，多突发）快闪记忆体264兆移动存储芯片，1.8V电源多芯片封
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位（复用的I / O，多银行，多层次，多突发）快闪记忆体24兆移动存储芯片，1.8V电源多芯片封
|
意法半导
STMicroelectronics N.V.
|
| M36P0R9070E0ZACF M36P0R9070E0 M36P0R9070E0ZAC M36P |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package 512兆位（x16插槽，多银行，多层次，多突发28兆位闪存（突发）移动存储芯片.8V电源，多芯片封装
|
STMicroelectronics N.V.
STMICROELECTRONICS[STMicroelectronics]
|
| PC755BM8 |
PC755B 1MByte backside L2-cache Multi-Chip Package
|
Atmel
|
| TH50VSF3580AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| AM45DL3208G AM45DL3208GT85IT AM45DL3208GT85IS AM45 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| W3H64M72E-ESM |
64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
|
White Electronic Designs Co...
|
| AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
| W3H32M64E-XSBX W3H32M64E-400ES W3H32M64E-400ESC W3 |
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| AM41DL6408H8H85IT AM41DL6408H AM41DL6408H8H70IS AM |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
